Non-volatile memory and method of controlling the same

ABSTRACT

A single cell that has a gate insulating film formed with an ONO film is provided in a region in which two bit lines cross one word line. The single cell is a four-bit multi-value cell, and has four charge accumulation regions. Two plug-like control electrodes are provided in the region surrounded by the word line and the bit lines. A bias is applied to one of the plug-like control electrodes and the word line so that the portion on the surface of the semiconductor substrate that is located immediately below the word line and corresponds to the location of the bias-applied control electrode is put into an accumulation state or a depletion state. In this manner, the width of the channel is adjusted, and the charge holding state of each of the four charge accumulation regions is controlled through the channel width adjustment.

CROSS-REFERENCES TO RELATED APPLICATIONS

This is a continuation of International Application No.PCT/JP2005/001246 filed Jan. 28, 2005, which was not published inEnglish under PCT Article 21(2).

BACKGROUND

1. Field of the Invention

The present invention relates to a SONOS non-volatile memory and amethod of controlling a SONOS non-volatile memory, and moreparticularly, to a multi-value technique for increasing the storagecapacity per unit cell without a decrease in the area of each unit cell.

2. Description of the Related Art

There has been a SONOS structure developed as one type of non-volatilememory structure. In the SONOS structure, an ONO film (a laminated filmof oxide film/nitride film/oxide film) is used as the gate insulatingfilm to be provided immediately below the gate electrode. Charges arelocally accumulated in the nitride film (generally, a silicon nitridefilm) in the vicinity of the source region and the drain region and datastorage by two bits per cell can be carried out.

FIGS. 1A through 1C are schematic views of the multi-value cellstructure of a SONOS non-volatile memory as disclosed by Boaz Eitan etal., in Electron Device Letters, Vol. 21, No. 11, p543-545 (2000) (“Boazet al.”). FIG. 1A is a schematic plan view of a cell and its vicinityarea. FIG. 1B is a schematic cross-sectional view of the area in thevicinity of the single cell, taken along the line A-A′ of FIG 1A. FIG.1C is a schematic cross-sectional view of the area in the vicinity ofthe single cell, taken along the line B-B′ of FIG. 1A.

In FIG. 1A, the region surrounded by the broken line is the region of asingle memory cell 10. This single cell 10 is located in a region inwhich two bit lines 13 (BL1) and 14 (BL2) cross a word line 15 (WL1).The two bit lines 13 and 14 extend in the vertical direction of thedrawing, and have electrodes 17 and 18 to which a bias can be applied.The word line 15 extends in the horizontal direction of the drawing. Thesingle cell 10 is a 2-bit multi-value cell, and has two chargeaccumulation regions 11 and 12. A word line 16 (WL2) is connected to asingle cell (not shown) that is located on the lower side of the drawingand is adjacent to the single cell 10.

As shown in FIG. 1B, an ONO film is formed as a gate insulating film 19on the bit lines 13 and 14. The ONO film is a three-layer structure thatincludes a lower silicon oxide film 20, a silicon nitride film 21, andan upper silicon oxide film 22 stacked in this order. The word line 15is formed on the ONO film.

Two portions of the silicon nitride film 21 in the vicinity of the bitlines 13 and 14 serve as charge accumulation regions 11 and 12 forholding and releasing charge in accordance with applied bias. The chargeaccumulation regions 11 and 12 are mirror symmetric to each other. Inshort, the charge accumulation regions constitute a mirror bitstructure. As shown in FIG. 1C, side walls 23 are formed on side facesof the word line 15 and the gate insulating film 19.

FIGS. 2A through 2D illustrate a situation in which charges are held inthe SONOS non-volatile memory illustrated in FIGS. 1A through 1C. FIGS.2A through 2D are schematic cross-sectional views of the SONOSnon-volatile memory taken along the line A-A′ of FIG. 1A. As describedabove, the single cell 10 has the two charge accumulation regions 11 and12. Accordingly, four different charge holding states (storage states)can be observed through combinations of the state in which charges areaccumulated in a charge accumulation region (represented by “0”) and thestate in which charges are not accumulated in a charge accumulationregion (represented by “1”). More specifically, FIG. 2A shows the state(11) in which charges are not accumulated in either of the chargeaccumulation regions 11 and 12. FIG. 2B shows the state (01) in whichcharges are accumulated in the charge accumulation region 11 but are notaccumulated in the charge accumulation region 12. FIG. 2C shows thestate (10) in which charges are accumulated in the charge accumulationregion 12 but are not accumulated in the charge accumulation region 11.FIG. 2D shows the state (00) in which charges are accumulated in both ofthe charge accumulation regions 11 and 12.

Recently, increasing memory capacity has been one of the criticalobjectives in the development of non-volatile memories. The SONOSnon-volatile memory disclosed by Boaz Eitan et al., has a storagecapacity of 2 bits per cell. However, to further increase the memorycapacity, it is necessary to reduce the area of each unit cell throughminiaturization techniques.

However, when a memory is manufactured in accordance with theseminiaturization techniques so as to reduce the cell area, a newtechnology for avoiding technical problems caused in conjunction withthe miniaturizing process is demanded, and an increase in productioncosts is caused. As a result, a technique for increasing the storagecapacity per unit cell without a decrease in unit cell area is required.

SUMMARY OF THE INVENTION

It is therefore an object of the present invention to provide anon-volatile memory that can increase the storage capacity per unit cellwithout a decrease in unit cell area, and a method of controlling such anon-volatile memory.

So as to achieve the above object, the present invention provides anon-volatile memory that includes a gate insulating film that includesan ONO film having a first oxide film, a nitride film, and a secondoxide film stacked in this order on a semiconductor substrate andcontrol electrodes that are provided on both sides of a gate electrodeof each memory cell. In this structure, the control electrodes providedon both sides of a gate electrode of each memory cell allow voltage tobe applied to a selected control electrode and the gate electrode.

Accordingly, charge can be accumulated in two or more regionsindependently of each other in the nitride film.

In a non-volatile memory in accordance with the present invention, acharge accumulation region in the nitride film interposed between thecontrol electrodes is operatively divided into four parts. With thisstructure, the storage capacity per unit cell can be increased.

In the non-volatile memory in accordance with the present invention, achannel formed between the control electrodes has a width less than halfthe width of the gate electrode. With this structure, control can beperformed so that charge is accumulated in the two or more regionsindependently of each other in the nitride film.

In the non-volatile memory in accordance with the present invention,each memory cell has four charge accumulation regions located below thegate electrode, and the four charge accumulation regions are arranged inrows and columns. Accordingly, a charge accumulation region can beselected by switching addresses.

In the non-volatile memory in accordance with the present invention, thememory cells are arrayed in a first direction and a second direction.This non-volatile memory further includes word lines and bit linesrunning in the first direction and the second direction respectively. Inthis non-volatile memory, the word lines provide gate electrodes for thememory cells aligned in the first direction, and the bit lines providesources and drains for the memory cells aligned in the second direction.Accordingly, the number of memory cells per unit area on thesemiconductor substrate can be increased.

In the non-volatile memory in accordance with the present invention, thebit lines are embedded in the semiconductor substrate. Since there is noneed to maintain a space for the bit lines on the semiconductorsubstrate, the number of memory cells can be increased or some othercomponent can be placed on the semiconductor substrate.

In the non-volatile memory in accordance with the present invention,each of the control electrodes is provided in a region defined by twoadjacent word lines and two adjacent bit lines. Accordingly, it becomeseasier to form a channel region and accumulation regions foraccumulating charge selectively in the charge accumulation regions.

In the non-volatile memory in accordance with the present invention, thecontrol electrodes are arranged in rows and columns. With thisstructure, a control electrode necessary for write or read can beproperly selected.

In the non-volatile memory in accordance with the present invention, thegate electrode and the control electrodes are supplied with voltagessuch that a channel width becomes less than half the width of the gateelectrode.

In the non-volatile memory in accordance with the present invention, thegate electrode is supplied with a voltage equal to or higher than athreshold voltage so that a region in the semiconductor substratelocated below the gate insulating film serves as a channel region. Oneof the control electrodes is supplied with a control voltage so that aregion in the semiconductor substrate in the vicinity of this one of thecontrol electrodes is an accumulation region. In this structure, adepletion region formed in the semiconductor substrate and locatedbetween the accumulation region and the channel region defines a channelwidth. Accordingly, charge can be accumulated selectively in the chargeaccumulation regions in the nitride film.

In the non-volatile memory in accordance with the present invention,conditions for biasing the sources and drains are alternately switchedso that write and read operations may be performed. As the conditionsfor biasing the sources and drains are alternately switched, write andread operations can be performed on the memory cells.

In the non-volatile memory in accordance with the present invention, thegate electrodes are preferably made of polysilicon.

In the non-volatile memory in accordance with the present invention, thesemiconductor substrate may be composed of a P-conduction type, and thegate receives a positive bias voltage while the control electrodesreceive negative bias voltages. As the biases to be applied to the gateelectrode and the control electrodes are adjusted in accordance with theconductivity type of the semiconductor substrate, a desired chargeaccumulation region can be selected and operations such as chargeaccumulation and reading can be performed on the selected chargeaccumulation region.

In the non-volatile memory in accordance with the present invention, thesemiconductor substrate may alternatively be composed of an N-conductiontype, and the gate receives a negative bias voltage while the controlelectrodes receive positive bias voltages. As the biases to be appliedto the gate electrode and the control electrodes are adjusted inaccordance with the conductivity of the semiconductor substrate, adesired charge accumulation region can be selected and operations suchas charge accumulation and reading can be performed on the selectedcharge accumulation region.

The present invention also provides a method of controlling anon-volatile memory having an ONO film on a semiconductor substrate.This method includes the steps of applying a voltage to a gate electrodethat is shared among memory cells and applying another voltage to one oftwo control electrodes between which the gate electrode is interposed.Here, four charge accumulation regions are formed in a nitride film ofthe ONO film in a region that is located below the gate electrode and isinterposed between the two control electrodes. As voltages are appliedto the selected control electrode and the gate electrode, charges can beaccumulated in the charge accumulation regions independently of eachother in the nitride film.

In accordance with this method, the voltage to be applied to the gateelectrode may be a positive voltage, while the voltage to be applied tothe selected control electrode would then be a negative voltage.

Alternatively, in accordance with this method, the voltage to be appliedto the gate electrode may be a negative voltage, while the voltage to beapplied to the selected control electrode would then be a positivevoltage.

While two portions of the ONO film in the vicinity of the source and thedrain below the word line serve as the charge accumulation regions in aconventional structure, four charge accumulation regions are formed bydividing each of the two charge accumulation regions into two regions inaccordance with the present invention. Accordingly, the presentinvention can provide a multi-value cell technique that increases thestorage capacity per unit cell to four times as large (four bits percell) as the storage capacity of a conventional cell without a reductionin unit cell area.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A through 1C are schematic views illustrating the multi-valuecell structure of a conventional SONOS non-volatile memory;

FIGS. 2A through 2D illustrate the charge holding states of the SONOSnon-volatile memory shown in FIGS. 1A through 1C;

FIG. 3 is a schematic plan view illustrating the concept of amulti-value cell structure and showing the layout of the chargeaccumulation regions provided in each memory cell in accordance with anembodiment of the present invention;

FIGS. 4A through 4C illustrate the situation in which the region on thesurface of the semiconductor substrate located immediately below theword line is put into an accumulation state when a bias is applied to acontrol electrode in accordance with an embodiment of the presentinvention;

FIGS. 5A through 5C illustrate a variation of the location and the widthof the channel that is caused when a bias is applied to the word line inaccordance with an embodiment of the present invention;

FIGS. 6A through 6C illustrate another variation of the location and thewidth of the channel that is caused when a bias is applied to the wordline in accordance with an embodiment of the present invention;

FIGS. 7A and 7B illustrate the gate voltage dependence of the channelwidth that is observed when a bias is applied to only one of the controlelectrodes in accordance with an embodiment of the present invention;

FIGS. 8A through 8D illustrate the conditions (ON/OFF) for biasapplication to the control electrodes so as to achieve sixteen chargeholding states in a 4-bit cell in accordance with an embodiment of thepresent invention;

FIGS. 9A through 9D also illustrate the conditions (ON/OFF) for biasapplication to the control electrodes so as to achieve sixteen chargeholding states in a 4-bit cell in accordance with an embodiment of thepresent invention;

FIGS. 10A through 10D also illustrate the conditions (ON/OFF) for biasapplication to the control electrodes so as to achieve sixteen chargeholding states in a 4-bit cell in accordance with an embodiment of thepresent invention;

FIGS. 11A through 11D also illustrate the conditions (ON/OFF) for biasapplication to the control electrodes so as to achieve sixteen chargeholding states in a 4-bit cell in accordance with an embodiment of thepresent invention;

FIGS. 12A through 12D are schematic cross-sectional views illustratingan example of the process for manufacturing a SONOS non-volatile memoryin accordance with a first embodiment of the present invention;

FIGS. 13A through 13D are schematic cross-sectional views illustratingthe example of the process for manufacturing a SONOS non-volatile memoryin accordance with the first embodiment of the present invention;

FIG. 14 is a schematic plan view during a step in the process formanufacturing a SONOS non-volatile memory in accordance with the firstembodiment of the present invention;

FIGS. 15A through 15D are schematic cross-sectional views illustratingan example of the process for manufacturing a SONOS non-volatile memoryin accordance with a second embodiment of the present invention;

FIGS. 16A through 16D are schematic cross-sectional views illustratingthe example of the process for manufacturing a SONOS non-volatile memoryin accordance with the second embodiment of the present invention;

FIG. 17 is a schematic plan view during a step in the process formanufacturing a SONOS non-volatile memory in accordance with the secondembodiment of the present invention;

FIGS. 18A and 18B illustrate the write operation of a SONOS non-volatilememory in accordance with an embodiment of the present invention: eachleft side drawing is a schematic plan view of two adjacent cells andtheir vicinity area; and each right-side drawing is a schematiccross-sectional view of a single cell, taken along the line B-B′ of eachleft-side drawing;

FIG. 19 illustrates the write operation and the read operation of aSONOS non-volatile memory in accordance with an embodiment of thepresent invention;

FIG. 20 illustrates the control voltages and the charge holding statesof the charge accumulation regions at the time of writing in accordancewith an embodiment of the present invention;

FIGS. 21A and 21B illustrate the read operation of a SONOS non-volatilememory in accordance with an embodiment of the present invention: eachleft side drawing is a schematic plan view of two adjacent cells andtheir vicinity area; and each right-side drawing is a schematiccross-sectional view of a single cell, taken along the line B-B′ of eachleft-side drawing;

FIG. 22 shows the control voltages and the drain current flowing fromthe charge accumulation regions at the time of reading in accordancewith an embodiment of the present invention;

FIG. 23 is a block diagram of a SONOS non-volatile memory in accordancewith an embodiment of the present invention; and

FIGS. 24A and 24B illustrate the detailed structure of the side gatevoltage generating/controlling circuit in accordance with an embodimentof the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following is a description of embodiments of the present invention,with reference to the accompanying drawings.

In accordance with the present invention, so as to increase the storagecapacity per single cell, four charge accumulation regions are formed bydividing each of two charge accumulation regions into two regions. In aconventional structure, the two charge accumulation regions are formedin the vicinity of the source/drain of the nitride film of an ONO filmprovided below the word line.

In accordance with the present invention, each single cell serves as aSONOS non-volatile memory of four bits per cell. Accordingly, chargeholding states (storage states) of sixteen different types can beobtained and a storage capacity per unit cell that is four times aslarge as the conventional storage capacity per unit cell can beachieved.

FIG. 3 is a schematic plan view illustrating the arrangement of thecharge accumulation regions provided in each memory cell, illustratingthe concept of achieving a multi-value technique in accordance with thepresent invention. In FIG. 3, the region surrounded by a broken line isthe region of a single cell 100, and four single cells are shown in FIG.3. The single cell 100 is provided at a location at which two bit lines105 and 106 cross a word line. The two bit lines 105 and 106 extend inthe vertical direction of the drawing and have electrodes 107 and 108.The word line 110 has an electrode 109 and extends in the horizontaldirection. The gate insulating film of the single cell 100 is alsoformed with an ONO film, and has side walls formed on the sides of thegate insulating film and the word line 110.

The single cell 100 is a multi-value cell of four bits, and includesfour charge accumulation regions denoted by reference numerals 101, 102,103, and 104. Two plug-like control electrodes 111 and 112 forcontrolling the width of a channel to be formed in a region on thesurface of a semiconductor substrate immediately below the word line 110upon application of a bias in a later described manner, are formed ineach region surrounded by word lines and bit lines. More specifically,when a bias is applied to the plug-like control electrodes 111 and 112and the word line 110, the region on the surface of the semiconductorsubstrate that is immediately below the word lines and corresponds tothe location of the bias applied control electrodes is put into anaccumulation state or a depletion state. Accordingly, the channel widthis controlled and, thereby, the charge holding state of each of the fourcharge accumulation regions is controlled through the control of thechannel width.

FIGS. 4A through 4C illustrate the situation in which the region on thesurface of the semiconductor substrate immediately below the word lineis put into an accumulation state when a bias is applied to theplug-like control electrodes. FIG. 4A is a schematic plan view of twoadjacent cells and their neighboring area. FIG. 4B is a cross-sectionalview of a single cell, taken along the line A-A′ of FIG. 4A. FIG. 4C isa cross-sectional view of a single cell, taken along the line B-B′ ofFIG. 4A. The upper half of FIG. 4C illustrates a situation in which abias is not applied to the plug-like control electrodes 111 and 112. Thelower half illustrates a situation in which a bias is applied to theplug- like control electrode 112.

As a bias is applied to one of the two plug-like control electrodes 111and 112 (112 in FIG. 4C) that is newly provided in the region surroundedby bit lines and word lines, the region on the surface of thesemiconductor substrate on the side of the bias-applied plug-likecontrol electrode 112 is put into an accumulation state. Theaccumulation region partially covers the surface of the substrate onwhich the single line cell 100 connected to the word line 110 isdisposed and the surface of the substrate on which a single cell 100′connected to a word line 110′ is disposed. The single cell 100 and thesingle cell 100′ are provided on both sides of the bias-appliedplug-like control electrode 112 (the lower half of FIG. 4C). Therectangle shown in FIG. 4A conceptually represents the accumulationregion.

Here, the type (negative or positive) and the size of the bias to beapplied are determined by the conductivity type and the permitivity ofthe substrate employed. The size of the bias needs to be larger than thedifference between the voltage applied to the gate electrode and thethreshold voltage for each cell at the time of erasing. The type of biasis negative when the semiconductor substrate is of a P-conduction type,and is positive when the semiconductor substrate is of an N-conductiontype. In this description of embodiments of the present invention, thesemiconductor substrate is of P-conduction type, unless otherwisespecified. Accordingly, the bias applied so as to turn the abovedescribed region on the surface of the semiconductor substrate into anaccumulation region is negative.

Since the non-volatile memory is of a SONOS type, a gate insulating film19 formed on the bit lines is an ONO film that has a silicon oxide film20, a silicon nitride film 21, and a silicon oxide film 22 stacked inthis order. Side walls 23 are formed on the sides of the word lines andthe gate electrode film.

FIGS. 5A through 5C and FIGS. 6A through 6C illustrate variations of thelocation and the width of the channel that are caused when a bias isapplied to the word lines. FIGS. 5A and 6A are schematic plan views eachillustrating two adjacent cells and their vicinity. FIGS. 5B and 6B areschematic cross-sectional views of the single cells, taken along theline C-C′ of FIG. 5A and the line D-D′ of FIG. 6A, respectively. FIGS.SC and 6C are schematic cross-sectional views of the single cells, takenalong the line B-B′ of FIGS. 5A and 6A.

Referring first to FIGS. 5A through SC, a voltage Vg (a positive voltagein this case) that is equal to or higher than a threshold voltage valueis applied to the word line 110, while an accumulation state illustratedin the lower half of FIG. 4C is formed by applying a bias to theplug-like control electrode 112. A depletion region is then formed on aside face of the accumulation region formed on the surface of thesemiconductor substrate immediately below the word line 110 in thevicinity of the plug-like control electrode 112. As a result, a channelis selectively formed in a region that is located immediately below theword line 110 on the opposite side from the plug-like control electrode112 and is on the side of the unbiased control electrode 111.

The width of the channel varies with the magnitude of the negativevoltage to be applied to the control electrode and the magnitude of thepositive voltage to be applied to the word line. In the presentinvention, however, bias setting is performed so that the channel widthbecomes less than ½of the cell width. By doing so, charge injection canbe performed on the charge accumulation region 101 through the bit line105 and on the charge accumulation region 104 through the bit line 106independently of each other.

Referring now to FIGS. 6A through 6C, an accumulation state is formed inthe region on the surface of the semiconductor substrate immediatelybelow the plug-like control electrode 111 by applying a bias thereto. Asa voltage V_(g) (also a positive voltage in this case) that is equal toor higher than a threshold voltage value is applied to the word line110, a depletion region is formed on a side face of the accumulationregion formed on the surface of the semiconductor substrate immediatelybelow the word line 110 in the vicinity of the plug-like controlelectrode 111. As a result, a channel is selectively formed in a regionthat is located immediately below the word line 110 on the opposite sidefrom the plug-like control electrode 111 and is on the side of theunbiased control electrode 112. Here, bias setting is also performed sothat the channel width becomes less than ½ of the cell width. By doingso, charge injection can be performed on the charge accumulation region102 through the bit line 105 and on the charge accumulation region 103through the bit line 106 independently of each other.

As described above, in accordance with the present invention, chargescan be accumulated in the four independent regions on the nitride filmof the gate insulating film located below the word line and amulti-value operation can be realized, with the number of bits in eachsingle cell being four.

FIGS. 7A and 7B illustrate the gate voltage dependence of the channelwidth in a case where a bias is applied to only one of the controlelectrodes. As shown in FIG. 7A, a bias V_(g) that is equal to or higherthan a threshold voltage value V_(th) is applied to the gate electrodewhile a bias is applied to only one electrode (Electrode 1) of the twocontrol electrodes. FIG. 7B shows the potential distribution on thesurface of a silicon substrate as it relates to the distance from thecenter of the biased control electrode (or the distance from the sidegate). As shown in this drawing, the potential curve varies with theapplied gate voltage V_(g), and the areas of the accumulation region,the depletion region, and the inversion region (the channel) vary withthe variation of the potential curve. As already mentioned, a gatevoltage Vg is applied so that the channel width becomes less than ½ ofthe word line width in the present invention. Therefore, a bias that isequal to or higher than the gate voltage V_(g), according to thepotential curve as indicated by the solid line in FIG. 7B, is applied.

FIGS. 8A through 11D are schematic cross-sectional views showing therelationships between the bias application (ON/OFF) to the plug-likecontrol electrodes 1 11 and 112 and the sixteen patterns of chargeholding states that are observed with each four-bit cell in accordancewith the present invention. In these drawings, B-B′, C-C′, and D-D′indicate the lines shown in FIGS. 5A and 6A, and sections taken alongthose lines are shown. In these drawings, the two control electrodes arerepresented by electrodes “#1” and “#2”, the word line is represented by“WL”, and the two bit lines are represented by “BL 1” and “BL2”. Also inthese drawings, a status (abcd) indicates that the states of the chargeaccumulation regions 101, 104, 102, and 103 are a, b, c, and d. Forexample, the status (1110) indicates that the charge accumulationregions 101, 104, and 102 are empty (status “1”) and only the chargeaccumulation region 103 holds charge (status “0”).

In the following, the present invention is described in greater detail,by way of specific examples.

Manufacturing Process 1

FIGS. 12A through 14 illustrate an example of the process ofmanufacturing a SONOS non-volatile memory having the above describedplug-like control electrodes in accordance with the present invention.First, an insulating film 19 having an ONO structure is formed bystacking a silicon oxide film 20 having a film thickness of 7.8 nm, asilicon nitride film 21 having a film thickness of 8.5 nm, and a siliconoxide film 22 having a film thickness of 10 nm in this order on a p-typesilicon substrate. A phosphorus-doped polysilicon film (120 nm in filmthickness) is formed on the insulating film 19 (FIG. 12A).

The word lines 110 are then formed by patterning the polysilicon film bya photolithography technique and an etching technique (FIG. 12B). Thebit lines 105 and 106 are then formed by performing ion implantationwith arsenic on the surface of the silicon substrate by aphotolithography technique and an ion implantation technique (FIG. 12C).Here, the conditions for ion implantation include an implantation energyof 70 KeV, and an ion implantation concentration of 2×10¹⁵ cm⁻³.

The insulating film having the ONO structure is removed except for theportion immediately below the word lines, and the side walls 23 areformed on the sides of the word lines 110 and the ONO film 19 (FIG.12D). The side wall formation is carried out, for example, by forming asilicon nitride film 113 having a film thickness of 20 nm and a siliconoxide film 114 having a film thickness of 90 nm, and then performingetchback on these two films.

After the above described procedures, the layout illustrated in theschematic plan view of FIG. 14 is obtained and plug-like controlelectrodes are to be formed in the region indicated by the broken linein the drawing. In the following, the procedures for forming theplug-like control electrodes and the procedures following are describedin conjunction with FIGS. 13A through 13D that are schematiccross-sectional views taken along the line E-E′ of FIG. 14.

First, an interlayer insulating film 115 such as a BPSG (boro-phosphosilicated glass) film having a thickness of 1500 nm, for example, isdeposited on the entire surface of the substrate (FIG. 13A). Contactholes are then formed between the side walls of word lines (denoted byWL1 through WL3) and on the word lines by a photolithography techniqueand an etching technique (FIG. 13B). The bottom of each of the contactholes (contact holes C) formed on the word lines is located in the sameplane as the upper face of each word line. The bottom of each of thecontact holes formed between the side walls of the word lines (thecontact holes B) is located in the same plane as the upper face of theremaining silicon nitride film 113 that functions as an etching stopperlayer. The bottom of the contact hole (the contact hole A) that isadjacent to a contact hole B and is formed in a region not in contactwith a side wall of the adjacent word lines is located in the same planeas the surface of the silicon substrate. Accordingly, contact holes Athrough C of three different types are formed at the same time.

Following contact hole formation, a laminated film 116 is provided (FIG.13C). The laminated film 116 includes a barrier metal layer having atwo-layer structure of a TiN film (15 nm in thickness) and a Ti film (40nm in thickness), and a tungsten film (400 nm in thickness) formedthrough CVD on the barrier metal layer. After polishing is performed onthe tungsten film by CMP, an Al line 117 is formed, and the electrodeformation at each contact hole is completed (FIG. 13D). The electrodesembedded in the contact holes C are to serve as word lines contacts. Theelectrodes embedded in the contact holes B are to serve as plug-likecontrol electrodes. The electrode embedded in the contact hole A is toserve as the substrate contact.

In the above described manner, a SONOS non-volatile memory havingplug-like control electrodes in accordance with the present invention isobtained.

Manufacturing Process 2

FIGS. 15A through 17 illustrate another example of the process ofmanufacturing a SONOS non-volatile memory in accordance with the presentinvention. First, an insulating film 19 having an ONO structure isformed by stacking a silicon oxide film 20 having a film thickness of7.8 nm, a silicon nitride film 21 having a film thickness of 8.5 nm, anda silicon oxide film 22 having a film thickness of 10 nm in this orderon a p-type silicon substrate. A phosphorus-doped polysilicon film (120nm in film thickness) is formed on the insulating film 19 (FIG. 15A).

The word lines 110 are then formed by patterning the polysilicon film bya photolithography technique and an etching technique (FIG. 15B). Thebit lines 105 and 106 are then formed by performing ion implantationwith arsenic on the surface of the silicon substrate by aphotolithography technique and an ion implantation technique (FIG. 15C).Here, the conditions for ion implantation include an implantation energyof 70 KeV, and an ion implantation concentration of 2×10¹⁵ cm⁻³.

The insulating film having the ONO structure is removed except for theportion immediately below the word lines, and side walls 23 are formedon the sides of the word lines and the ONO film (FIG. 15D). The sidewall formation is carried out, for example, by forming a silicon nitridefilm 113 having a film thickness of 20 nm and a silicon oxide film 114having a film thickness of 90 nm, and then performing etchback on thesetwo films.

After the above described series of procedures illustrated in FIGS. 15Athrough 15D, the layout illustrated in the schematic plan view of FIG.17 is obtained and plug-like control electrodes are to be formed in theregion indicated by the broken line in the drawing. In the following,the procedures for forming the plug-like control electrodes and theprocedures following are described in conjunction with FIGS. 16A through16D that are schematic cross-sectional views taken along the line F-F′of FIG. 17.

First, a photoresist 118 is formed to cover the area except for the corecell regions on which side gates are to be formed by a photolithographytechnique (FIG. 16A). So as to turn the silicon nitride film 113 into anetching stopper film, etching is performed on the portion of the oxidefilm 114 that is not covered with the photoresist 118 (FIG. 16B). Thephotoresist 118 that is now unnecessary is removed and side gateelectrodes are formed on the bit lines that are not covered with theside walls 23 (FIG. 16C). The formation of the side gate electrodes maybe carried out by forming a polysilicon film, a film made of arefractory metal such as tungsten, or a silicide film made of arefractory metal such as tungsten silicide having a thickness ofapproximately 200 nm on the entire substrate, and then performingetchback on the film.

An interlayer insulating film 115 such as a BPSG film having a thicknessof approximately 1500 nm is further formed, and contact holes are thenformed in the interlayer insulating film 115 by a photolithographytechnique and an etching technique. Following the contact holeformation, a laminated film 116 is provided. The laminated film 116includes a barrier metal layer having a two-layer structure of a TiNfilm (15 nm in thickness) and a Ti film (40 nm in thickness), and atungsten film (400 nm in thickness) formed through CVD on the barriermetal layer. After polishing is performed on the tungsten film by CMP,an Al line 117 is formed (FIG. 16D).

In the above described manner, a SONOS non-volatile memory havingplug-like control electrodes in accordance with the present invention isobtained.

Write Operation

Next, the write operation of a SONOS non-volatile memory in accordancewith the present invention is described.

FIGS. 18A and 18B illustrate the write operation of a SONOS non-volatilememory in accordance with the present invention. The left-side drawingin each of FIGS. 18A and 18B is a schematic plan view of two adjacentcells and their vicinity, and the right-side drawing is a schematiccross-sectional view of a single cell, taken along the line B-B′ of eachof FIGS. 18A and 18B.

FIG. 18A shows the state of a memory cell after erase is performed onall the bits. The threshold voltage V_(th) of each memory cell is, forexample, 1.5 V. A voltage V_(sg) adjusted so as to deplete a portion ofthe surface of the silicon substrate that is half the width of a wordline at the time of operation is applied to the plug-like controlelectrode 112 which is one of the two plug-like control electrodesprovided on both sides of each single cell. For example, a voltage ofapproximately −4V is applied to the plug-like control electrode 112 andthe other plug-like control electrode 111 is grounded to be 0V. As avoltage V_(g) (2V, for example) that is equal to or higher than thethreshold value is applied to the gate electrode, a channel is formedimmediately below the word line WL1 on the opposite side from theplug-like control electrode 112 (the right-side drawing in FIG. 18A).

In this situation, the bit line 105 is grounded, and a voltage of 1V,for example, is applied to the bit line 106. Hot electrons generated inthe vicinity of the bit line 106 are then accumulated in the siliconnitride film of the charge accumulation region 104. If the conditionsfor voltage application to the bit line 105 and the bit line 106 arereversed, charges can be accumulated in the silicon nitride film of thecharge accumulation region 101.

In an opposite situation from the above, a voltage V_(sg) of −4V isapplied to the plug-like control electrode 111, and the plug-likecontrol electrode 112 is grounded to be 0V, as shown in FIG. 18B. As avoltage V_(g) of 2V is applied to the gate electrode, a channel isformed immediately below the word line WL1 on the opposite side from theplug-like control electrode 111 (the right-side drawing in FIG. 18B). Inthis situation, the bit line 105 is grounded, and a voltage of 1V, forexample, is applied to the bit line 106. As a result, hot electronsgenerated in the vicinity of the bit line 106 are accumulated in thesilicon nitride film of the charge accumulation region 103. If theconditions for voltage application to the bit line 105 and the bit line106 are reversed, charges can be accumulated in the silicon nitride filmof the charge accumulation region 102.

FIG. 20 is a timing chart of a write operation to be performedsequentially in the charge accumulation regions A, B, C, and D of asingle cell 100 shown in FIG. 19.

First, a voltage V_(sg) of −4V, for example, is applied to the plug-likecontrol electrode 112 and the plug-like control electrode 111 isgrounded to be 0V. A bias of a voltage V_(g) (2V, for example) that isequal to or higher than the threshold value is applied to the gateelectrode. In this situation, the word line WL1 is selected, and the bitline 106 is grounded. A voltage of 1V, for example, is applied to thebit line 105. As a result, charges are accumulated in the region A.While the electric conditions of the plug-like control electrodes 111and 112, the gate electrode, and the word line WL1 remain the same, avoltage of 1V is applied to the bit line 106, and the bit line 105 isgrounded. As a result, charges are accumulated in the region B.

Next, a voltage V_(sg) of −4V, for example, is applied to the plug-likecontrol electrode 111, and the plug-like control electrode 112 isgrounded to be 0V. A bias of a voltage V_(g) (2V, for example) that isequal to or higher than the threshold value is applied to the gateelectrode. In this situation, the word line WL1 is selected, and the bitline 106 is grounded. A voltage of 1V, for example, is applied to thebit line 105. As a result, charges are accumulated in the region C.While the electric conditions of the plug-like control electrodes 111and 112, the gate electrode, and the word line WL1 remain the same, avoltage of 1V is applied to the bit line 106, and the bit line 105 isgrounded. As a result, charges are accumulated in the region D.

Read Operation

Next, the read operation of a SONOS non-volatile memory in accordancewith the present invention is described.

FIGS. 21A and 21B illustrate the read operation of a SONOS non-volatilememory in accordance with the present invention. The left-side drawingin each of FIGS. 21A and 21B is a schematic plan view of two adjacentcells and their vicinity area, and the right-side drawing is a schematiccross-sectional view of a single cell, taken along the line B-B′ of eachof FIGS. 21A and 21B. Here, the threshold voltage V_(th) of each memorycell at the time of erasing is, for example, 1.5 V, and the thresholdvoltage V_(th)′ after writing is, for example, 2.0 V. A voltage V_(sg)(−4V, for example) adjusted so as to deplete a portion of the surface ofthe silicon substrate that is half the width of each word line at thetime of operation is applied to the plug-like control electrode 112.Meanwhile, the other plug-like control electrode 111 is grounded to be0V. As a voltage V_(g) of 2.5V, for example, is applied to the gateelectrode, a channel is formed immediately below the word line WL1 onthe opposite side from the plug-like control electrode 112 (FIG. 21A).

In this situation, the bit line 106 is grounded, and a voltage of 0.5V,for example, is applied to the bit line 105. If charges are accumulatedin the silicon nitride film in the vicinity of the bit line 106, a verylow drain current I_(ds) is obtained. When the conditions for voltageapplication to the bit line 105 and the bit line 106 are reversed, adesired drain current Ids can be obtained if charges are not accumulatedin the silicon nitride film in the vicinity of the bit line 105. Byvirtue of the difference in drain current, the charge holding state inthe vicinity of the plug-like control electrode 111 can be read.

A voltage V_(sg) of −4V is then applied to the plug-like controlelectrode 111 and the plug-like control electrode 112 is grounded to be0V. A voltage V_(g) of 2.5V is applied to the gate electrode. A channelis then formed immediately below the word line WL1 on the opposite sidefrom the plug-like control electrode 111. A read operation is thenperformed in the same manner as above so that the charge holding statein the vicinity of the plug-like control electrode 112 can be read (FIG.21B).

FIG. 22 is a timing chart of a read operation to be performedsequentially in the charge accumulation regions A, B, C, and D of thesingle cell 100 shown in FIG. 19.

First, a voltage V_(sg) of −4V, for example, is applied to the plug-likecontrol electrode 112 and the plug-like control electrode 111 isgrounded to be 0V. A bias of a voltage V_(g) (2.5V, for example) that isequal to or higher than the threshold voltage value is applied to thegate electrode. In this situation, the word line WL1 is selected and thebit line 105 is grounded. A voltage of 0.5V, for example, is applied tothe bit line 106. By doing so, the state of the region A can be read.The bit line 106 is then grounded and a voltage of 0.5V is applied tothe bit line 105. By doing so, the charges accumulated in the region Bcan be read. Here, a very low drain current Ids is obtained from thecharge accumulation region in which charges are accumulated, and thedesired drain current I_(ds) is obtained from the charge accumulationregion in which charges are not accumulated. FIG. 22 shows the draincurrent I_(ds) obtained in the case (1111) where charges are notaccumulated in any of the charge accumulation regions A, B, C, and D,and the drain current I_(ds) obtained in the case (0110) where chargesare accumulated in the regions A and D.

Likewise, to read the region C, a voltage V_(sg) of −4V, for example, isapplied to the plug-like control electrode 111 and the plug-like controlelectrode 112 is grounded to be 0V. A bias of a voltage V_(g) (2.5V, forexample) that is equal to or higher than the threshold value is appliedto the gate electrode. In this situation, the word line WL1 is selected,and the bit line 105 is grounded. A voltage of 0.5V, for example, isapplied to the bit line 106. By doing so, the state of the region C canbe read. The bit line 106 is then grounded and a voltage of 0.5V isapplied to the bit line 105. By doing so, the state of the region D canbe read.

As described so far, the present invention can provide a multi-valuecell technique that increases the storage capacity per unit cell to fourtimes as large (four bits per cell) as the storage capacity of aconventional cell without an increase in cell area.

FIG. 23 illustrates a circuit structure that performs data write andread operations on a SONOS non-volatile memory in accordance with thepresent invention. In a memory cell unit 30, a number of four-bit unitcells that are the same as those described above are arranged atintervals in a matrix fashion. A row decoder 31, a column decoder 32, asense amplifier 34, an address register 33, an input/output buffer 35, aread voltage generating/controlling circuit 37, a write voltagegenerating/controlling circuit 38, an erase voltagegenerating/controlling circuit 39, a side gate voltagegenerating/controlling circuit 40, and a command register 36 areprovided around the memory cell unit 30.

Commands that are input from the outside are accumulated in the 30command register 36 and the voltage generating/controlling circuits 37through 40 are activated in accordance with each input command. Theaddress of each memory cell for which write, read, or erase is to beperformed is supplied from the address register 33 to the column decoder32 and the row decoder 31. The row decoder 31 and the column decoder 32identify the address, and data write, read, or erase is then performed.FIG. 24A illustrates the structure of the side gate voltage generatingcircuit 40, which is the circuit that supplies a voltage V_(sg) to theplug-like control electrodes 111 and 112. Voltages F1, F2, F3, and F4are supplied to the circuit illustrated in FIG. 24A in accordance withthe timing shown in FIG. 24B, thereby generating a negative voltageV_(sg).

Although preferred embodiments of the present invention have beendescribed so far, the present invention is not limited to these specificexamples and various changes and modifications may be made to themwithout departing from the scope of the present invention as set forthin the claims appended hereto and their equivalents.

1. A non-volatile memory comprising: a gate insulating film thatincludes an ONO film having a first oxide film, a nitride film, and asecond oxide film stacked in this order on a semiconductor substrate;and control electrodes that are provided on both sides of a gateelectrode of each memory cell.
 2. The non-volatile memory as claimed inclaim 1, wherein a charge accumulation region in the nitride filminterposed between the control electrodes is operatively divided intofour parts.
 3. The non-volatile memory as claimed in claim 1, wherein achannel formed between the control electrodes has a width less than halfof a width of the gate electrode.
 4. The non-volatile memory as claimedin claim 1, wherein each memory cell has four charge accumulationregions located below the gate electrode, and the four chargeaccumulation regions are arranged in rows and columns.
 5. Thenon-volatile memory as claimed in claim 4, wherein the memory cells arearrayed in a first direction and a second direction, the non-volatilememory further comprising word lines and bit lines running in the firstdirection and the second direction respectively, wherein the word linesprovide gate electrodes of the memory cells aligned in the firstdirection and the bit lines provide sources and drains of the memorycells aligned in the second direction.
 6. The non-volatile memory asclaimed in claim 1, wherein the memory cells are arrayed in a firstdirection and a second direction, the non-volatile memory furthercomprising word lines and bit lines running in the first direction andthe second direction respectively, wherein the word lines provide gateelectrodes of the memory cells aligned in the first direction and thebit lines provide sources and drains of the memory cells aligned in thesecond direction.
 7. The non-volatile memory as claimed in claim 6,wherein the bit lines are embedded in the semiconductor substrate. 8.The non-volatile memory as claimed in any of claims 1, wherein each ofthe control electrodes is provided in a region defined by two adjacentword lines and two adjacent bit lines.
 9. The non-volatile memory asclaimed in any of claims 1, wherein the control electrodes are arrangedin rows and columns.
 10. The non-volatile memory as claimed in claim 1,wherein the gate electrode and the control electrodes are supplied withsuch voltages that a channel width becomes less than half the width ofthe gate electrode.
 11. The non-volatile memory as claimed in claim 1,wherein: the gate electrode is supplied with a voltage equal to orhigher than a threshold voltage so that a region in the semiconductorsubstrate located below the gate insulating film serves as a channelregion; one of the control electrodes is supplied with a control voltageso that a region in the semiconductor substrate in the vicinity of saidone of the control electrodes is an accumulation region; and a depletionregion formed in the semiconductor substrate and located between theaccumulation region and the channel region defines a channel width. 12.The non-volatile memory as claimed in claim 1, wherein conditions forbiasing the sources and drains are alternately switched so that writeand read operations are performed.
 13. The non-volatile memory asclaimed in claim 1, wherein the gate electrodes are made of polysilicon.14. The non-volatile memory as claimed in claim 1, wherein: thesemiconductor substrate is of a P-conduction type; and the gateelectrode receives a positive bias voltage, and the control electrodesreceive negative bias voltages.
 15. The non-volatile memory as claimedin claim 1, wherein: the semiconductor substrate is of an N-conductiontype; and the gate electrode receives a negative bias voltage, and thecontrol electrodes receive positive bias voltages.
 16. A method forcontrolling a non-volatile memory having an ONO film on a semiconductorsubstrate, the method comprising the steps of: applying a voltage to agate electrode that is shared among memory cells; and applying anothervoltage to one of two control electrodes between which the gateelectrode is interposed, wherein four charge accumulation regions beingformed in a nitride film of the ONO film in a region that is locatedbelow the gate electrode and is interposed between the two controlelectrodes.
 17. The method as claimed in claim 16, wherein: the step ofapplying a voltage includes applying a positive voltage to the gateelectrode; and the step of applying another voltage includes applying anegative voltage to said one of the two control electrodes.
 18. Themethod as claimed in claim 16, wherein: the step of applying a voltageincludes applying a negative voltage to the gate electrode; and the stepof applying another voltage includes applying a positive voltage to saidone of the two control electrodes.